BERGQUIST GAP FILLER TGF 4000 is a 4.0 W/m·K thermally conductive, ultra-conforming,silicone-based, two-part liquid gap filler designed for high-efficiency thermal management.

• Thermal conductivity of 4.0 W/m·K for enhanced heat dissipation

• Ultra-conforming silicone formulation for effective interface contact

• Extended working time supports greater manufacturing flexibility

• Low natural tack ideal for applications where strong structural bonding is not required

• Cures at room temperature, with the option to accelerate the process using heat